特斯拉的下一代 Dojo 人工智能训练加速器 “芯片” 已经在台积电生产，其形式很可能成为人工智能数据中心处理器的重要组成部分：全硅晶圆大小的处理器，称为晶圆上系统， Spectrum 报道称，台积电将在 2027 年提供全晶圆集成，这是比用于构建 Dojo 的工艺更复杂的工艺，可提供当今系统 40 倍的计算能力。 CoWoS 将发挥主导作用，HBM 内存也将发挥主导作用。$特斯拉.US $台積電.US $美光科技.US https://spectrum.ieee.org/tsmc-advanced-packaging
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