Long-term Value InvestorTesla's next-generation Dojo AI training accelerator "chip" is already in production at TSMC, and its form is likely to become a key component of AI data center processors: a full silicon wafer-sized processor, known as a wafer-scale system. Spectrum reports that TSMC will offer full wafer integration by 2027, a more advanced process than the one used to build Dojo, delivering 40 times the computational power of today's systems. CoWoS will play a leading role, as will HBM memory.$Tesla(TSLA.US) $Taiwan Semiconductor(TSM.US) $Micron Tech(MU.US) https://spectrum.ieee.org/tsmc-advanced-packaging
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