<p>Due to the insufficient supply of advanced packaging CoWoS from TSMC, there are reports that NVIDIA has recently approached Intel for advanced packaging. Supply chain manufacturers point out that TSMC's CoWoS-S is similar to Intel's Foveros packaging technology, which can quickly provide packaging capacity</p>

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<p>Due to the insufficient supply of advanced packaging CoWoS from TSMC, there are reports that NVIDIA has recently approached Intel for advanced packaging. Supply chain sources point out that TSMC's CoWoS-S is similar to Intel's Foveros packaging technology, which can quickly provide packaging capacity</p>

News: Intel reportedly receives packaging orders from Nvidia

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