Taiwan Semiconductor, Samsung, and IBM will showcase their latest CFET technology achievements at the IEDM international conference in December

The 70th IEEE International Electron Devices Meeting will be held in San Francisco from December 7th to 11th, 2024. Researchers from major semiconductor companies such as Taiwan Semiconductor, IMEC, IBM, and Samsung will gather to share the latest research findings on Vertical Stacked Complementary Field-Effect Transistor (CFET) technology. Although GAA FET technology has not yet been widely adopted by the industry, the next-generation CFET technology has been put on the agenda, which is considered an important development direction for next-generation semiconductor technology and is expected to achieve further process size reduction in the future. The concept of CFET was first proposed by IMEC in 2018, which involves vertically stacking n-type and p-type transistors in the same area. According to IMEC's roadmap, CFET is expected to achieve widespread production at the A5 process node