<p>Taiwan Semiconductor will expand its advanced packaging CoWoS capacity and will launch the SoW-X introduction system-level packaging this year, with mass production expected in 2027. The new photomask size increases by 9.5 times, providing 40 times the computing power compared to the current CoWoS solutions</p>

<p>Taiwan Semiconductor will expand its advanced packaging CoWoS capacity and will launch the SoW-X system-level packaging this year, with mass production expected in 2027. The new photomask size increases by 9.5 times, resulting in a 40 times increase in computing power compared to the current CoWoS solutions</p>

Taiwan Semiconductor expects to mass produce the SoW-X packaging system in 2027, with computing power increasing by 40 times