疯抢芯片市场！日本住友电木计划将在华半导体封装产能提高 50%

Zhitong
2021.07.27 05:59
日本住友电木 27 日宣布，将投资 25 亿日元在其中国子公司苏州住友电木建设一条新生产线，提高其 50% 的半导体封装产能，从目前的 1200 吨提高到 1800 吨。新生产线将于今年年底完成，目标在 2022 年初开始运营，并向中国国内市场发货。住友电木在全球以及中国半导体封装市场都占有 40% 的份额。
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