三大 DRAM 製造商都在擴大 HBM(高頻寬記憶體)晶元(AI 記憶體)的生產,這讓美國設備供應商應用材料公司(Applied Materials)急於提高產量。來自應用材料公司的訂單已將臺灣合同製造合作夥伴富森美半導體的工廠填滿,直到明年第二季度,訂單強度預計將持續到 2025 年。$應用材料(AMAT.US)$美光科技(MU.US)

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