大众汽车集团与 Onsemi 签署了一份多年期合同。未来，Onsemi 将成为大众 SSP 新型牵引逆变器的主要半导体供应商。SSP 作为大众的可扩展系统平台，计划从 2028 年起推出新一代电动汽车，如 Trinity 或第九代大众高尔夫等。该平台具备诸多优势，适用于多细分市场车型。
带有 SiC 半导体的模块将安装在 SSP 的 “PowerBox” 中，功率等级多样。Onsemi 还将在捷克的新工厂制造相关半导体，并推出新技术提升性能。双方高管均对此次合作表示满意，此前 Onsemi 已从大众获得过重要半导体订单。此次合作有望推动大众电动汽车发展，也将助力 Onsemi 扩大市场份额
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