News: Intel reportedly receives packaging orders from Nvidia

智通財經
2024.08.05 12:21
由於台積電先進封裝 CoWoS 產能始終供不應求，有消息稱英偉達日前找上英特爾進行先進封裝。供應鏈廠商指出，台積電 CoWoS-S 與英特爾 Foveros 封裝技術相似，能快速提供封裝產能。
Source: 智通財經 The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.