TCL sounds the drum for AI warfare

Author | Huang Yu

Editor | Liu Baodan

Two years after the big model has sparked a new wave of AI, TCL is finally ready to fully showcase its AI strategy to the outside world.

On December 11, the 2024 TCL Global Technology Innovation Conference was held. This is the first time TCL has transformed its internal model into an external communication format since the conference began eleven sessions ago, with AI as the theme.

TCL founder and chairman Li Dongsheng stated that this is the first time TCL has opened up to the entire industry to showcase its technological innovation achievements, especially in the strategic layout and results in emerging technology fields such as AI.

TCL released the "TCL All-Domain All-Scenario AI Application Solution," which includes five innovative application practices: AI intelligent operation, AI simulation, Xiao T central control large model, AI movie production, and Xingzhi X-Intelligence 2.0.

TCL's CTO and head of the TCL Industrial Research Institute, Yan Xiaolin, pointed out that AI applications are already ubiquitous in TCL, from B-end to C-end, from research and development, manufacturing to operations, and from interaction, picture quality to platforms.

TCL's business focuses on smart terminals, semiconductor displays, and new energy photovoltaics. It is reported that in 2024, TCL aims to create an economic benefit of 540 million yuan through the promotion and implementation of AI applications.

It has become a consensus that AI will reshape various industries, and many companies have gone all in on AI.

Li Dongsheng pointed out that the rise of AI is driving industrial transformation, and the disruption of old and new technologies profoundly affects the global industrial landscape. Currently, artificial intelligence technologies such as large models and generative AI are rapidly developing, with applications continuously expanding into fields such as healthcare, finance, transportation, and manufacturing. Although the development of AI technology and business models is not yet mature, there may be explosive opportunities in certain fields in the next three to five years.

In the face of increasing global technological competition, the rise of AI driving industrial transformation, and the need to improve the innovation ecosystem, Li Dongsheng also shared TCL's five major technology development strategies.

First, adhere to long-termism and enhance strategic planning capabilities. In the future, TCL will continue to focus on forward-looking AI technology research and development, concentrate core resources, leverage global layout advantages, avoid spreading resources too thin, build core capabilities in key directions, address actual business needs, and promote efficient implementation of technology.

Second, increase original technological breakthroughs to achieve "curve overtaking" in key areas. Third, adopt an engineering business mindset to accelerate the transformation of technological innovation achievements; fourth, improve product structure through technological innovation to break into the mid-to-high-end market; fifth, improve the technological innovation ecosystem to gather high-quality global innovation resources.

Li Dongsheng stated that in the current market competition, low-price competition is a dead end, leading only to endless "involution." To surpass competitors, it is essential to strive for breakthroughs in more mid-to-high-end products.

Technological innovation is a crucial driving force for TCL to navigate industry cycles, whether in smart terminals, semiconductor displays, or the photovoltaic industry In the field of semiconductor displays, after 11 years of investment, TCL Huaxing recently announced the official mass production of printed OLED.

Li Dongsheng stated that as early as ten years ago, TCL Huaxing chose printed OLED as the main direction for next-generation display technology for two main reasons: first, traditional OLED patents have already been laid out by leading companies, and TCL would face significant patent restrictions if it developed in this area; second, printed OLED is more competitive than traditional OLED.

Betting on printed OLED means that TCL can continue to maintain a leading position in the future semiconductor display field.

In the photovoltaic industry, which is still at the bottom of the industry, technological innovation is an important measure for TCL Zhonghuan to seek breakthroughs.

At this conference, Zhang Xuenan, vice president of TCL Zhonghuan Research Institute, announced two cutting-edge innovations: large-size ultra-thin silicon wafers for smart photovoltaics and TOPCon copper busbar components, which will help produce TOPCon batteries with higher efficiency and lower costs, promoting cost reduction and efficiency improvement in the industry.

Zhang Xuenan stated that it is now transitioning from P-type to N-type battery technology, as these two types have different material requirements. N-type monocrystalline requires higher lifespan, more concentrated resistance, and even demands on the cleanliness of the silicon wafer surface and metal content. Based on the technological accumulation of the industry, N-type silicon wafers have also integrated semiconductor-related process technologies, which can improve the quality of silicon wafers while ensuring optimal cost performance.

Therefore, large-size ultra-thin silicon wafers for smart photovoltaics represent TCL Zhonghuan's differentiated competitive advantage in the silicon wafer direction.

Regarding components, Zhang Xuenan introduced that the battery industry has always used silver paste for printing, and silver itself is a precious metal. The industry cannot avoid this path, and everyone is pursuing alternatives to silver, such as using copper and other metals. This time, the TOPCon copper busbar component is TCL Zhonghuan's first zero-silver content copper busbar component, which is also a first in the industry, further promoting cost reduction in the industry.

At the same time, based on copper busbar component technology, it can maximize the effective battery area under the same area, and the packaging density is 1.2% higher than that of conventional products. Coupled with the design of components without an A-side, it can achieve the ability to prevent water accumulation and dust accumulation, resulting in a system-side power generation gain of over 3%.

In the face of numerous challenges in the industry, TCL must always use technological innovation as a weapon to ensure further breakthroughs in its global development