Taiwan Semiconductor expects to mass produce the SoW-X packaging system in 2027, with computing power increasing by 40 times

智通財經
2025.04.25 12:05
台積電將擴充先進封裝 CoWoS 產能，今年將推出 SoW-X 導入系統級封裝，預計 2027 年量產。新品光罩尺寸增加 9.5 倍，相比目前 CoWoS 解決方案增 40 倍運算能力。
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