Over 16 billion yuan in scale! The first batch of securities companies' sci-tech bonds announced for issuance

On May 8, CITIC Securities Co., Ltd., Guotai Junan Securities Co., Ltd., CSC, and several other securities companies announced on the Shanghai Stock Exchange that they plan to issue a total of over 16 billion yuan in technology innovation bonds. This is the first batch of securities companies to announce the issuance of technology innovation bonds following the release of new regulations supporting their issuance.

On May 7, the People's Bank of China and the China Securities Regulatory Commission announced several important measures to support the issuance of technology innovation bonds. The three major stock exchanges also issued notifications on the same day to refine support measures. The exchange notifications clarified that, in addition to continuing to support the issuance of technology innovation bonds by issuers in categories such as technology innovation enterprises, technology innovation upgrades, technology innovation investments, and technology innovation incubation, they will also support financial institutions such as commercial banks, securities companies, and financial asset investment companies in issuing technology innovation bonds.

It is understood that the funds raised from the first batch of securities companies' technology innovation bonds will mainly be directed towards cutting-edge technology and strategic emerging industry segments such as integrated circuits, artificial intelligence, new energy, biomedicine, and high-end equipment. This is a beneficial exploration for securities companies to enhance their service efficiency for technology innovation, opening up medium- and long-term incremental funding for the technology innovation sector and further enhancing the financing capabilities of securities companies for technology innovation enterprises.

In addition, the new regulations have also received positive responses from technology-based enterprises and equity investment institutions. According to statistics from the Shanghai Stock Exchange, after the release of the exchange notification, there have been cumulative announcements of over 10 billion yuan in technology innovation bonds from the aforementioned enterprises and institutions. For example, China Petroleum & Chemical Corporation Capital Co., Ltd. announced plans to issue 900 million yuan in technology innovation bonds, with the raised funds intended for direct investment in technology-based enterprises in the fields of new materials, new energy, and intelligent manufacturing. Additionally, several equity investment institutions are actively preparing for the issuance of technology innovation bonds.

It is reported that after years of development, the technology innovation bonds on the Shanghai Stock Exchange have formed a separate sector, with all stock abbreviations marked with a K. The Shanghai Stock Exchange is currently working to implement relevant deployments and promote the effective implementation of various measures to support the issuance of technology innovation bonds. In the future, it will continue to improve the supporting mechanisms for technology innovation bonds and enhance the inclusiveness and adaptability of the system.

Xinhua News Agency, original title: "Scale Exceeds 16 Billion Yuan! First Batch of Securities Companies Announces Issuance of Technology Innovation Bonds"

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