TSMC will open a European chip design centre in Munich, Germany
TSMC, the world's largest contract chipmaker, will establish a chip design center in Munich, Germany, set to open in Q3 2025. This center aims to assist European clients in creating high-density, high-performance, and energy-efficient chips, focusing on automotive, industrial, AI, and IoT applications. Additionally, TSMC is collaborating with Infineon, NXP, and Robert Bosch to build a microchip manufacturing plant in Dresden, known as the European Semiconductor Manufacturing Company (ESMC).
By Nathan Vifflin
AMSTERDAM, May 27 (Reuters) - Taiwan Semiconductor Manufacturing Co 2330.TW, the world's largest contract chipmaker, will open a chip design centre in Munich, Germany, a company executive said on Tuesday.
President of TSMC Europe, Paul de Bot, said at the company's 2025 Technology Symposium event that the Munich Design Centre would open during the third quarter of 2025.
"It's intended to support European customers in designing high-density, high-performance, and energy-efficient chips with a focus on applications again in automotive, industrial, AI, and IoT," de Bot said.
TSMC is building together with Infineon IFXGn.DE, NXP NXPI.O and Robert Bosch a new microchip manufacturing plant in Dresden, Germany, called European Semiconductor Manufacturing Company (ESMC).
