Report: Samsung Electronics' 12-layer stacked HBM3E chip products pass NVIDIA testing

華爾街見聞
2025.09.19 10:26

據報道，三星電子 12 層堆疊 HBM3E 芯片產品最近通過了英偉達的認證測試。三星在完成該芯片研發約 18 個月後獲得了通過。

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