Report: Samsung Electronics' 12-layer stacked HBM3E chip products pass NVIDIA testing

华尔街见闻
2025.09.19 10:26

据报道，三星电子 12 层堆叠 HBM3E 芯片产品最近通过了英伟达的认证测试。三星在完成该芯片研发约 18 个月后获得了通过。

Source: 华尔街见闻 The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.