ASMPT (00522.HK) announced that it has recently obtained new orders from a leading foundry's major outsourced semiconductor assembly and test (OSAT) partner, involving 15 units of thermal compression bonding (TCB) equipment used for chip-to-substrate applications, which are expected to be used in the production of cutting-edge AI computing chips.
ASMPT CEO Jensen Huang stated that the acquisition of these orders confirms the customers' trust in the company as their preferred technology and production partner, and it is expected to strengthen ASMPT's position as a key driver in advanced packaging development

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ASMPT announced that it has obtained new orders for 15 thermal compression bonding (TCB) devices from a leading foundry's major outsourced semiconductor assembly and test (OSAT) partner, which are expected to be used in the production of cutting-edge AI computing chips. ASMPT's CEO Jensen Huang stated that this confirms customers' trust in the company as their preferred technology and manufacturing partner, and it is expected to strengthen ASMPT's position as a key driver of advanced packaging development

ASMPT has obtained new orders for chip-to-substrate TCB equipment