台湾合同芯片制造商台积电在美国的投资
Taiwan's TSMC plans to invest $250 billion in the U.S. to enhance semiconductor, energy, and AI production, as part of a trade deal with the U.S. The investment includes $100 billion already committed by TSMC by 2025. TSMC is expanding its manufacturing capacity in Arizona, with plans for multiple fabs and advanced facilities. The first fab is set for volume production in late 2024, while the second fab will utilize 3-nm technology by 2027. Major customers include Apple, Nvidia, AMD, and Qualcomm.
By Wen-Yee Lee
Jan 16 (Reuters) - The U.S. and Taiwan reached a trade deal on Thursday under which Taiwanese companies will invest $250 billion to boost production of semiconductors, energy and artificial intelligence in the United States.
The agreement includes $100 billion already committed by semiconductor giant TSMC (2330.TW) in 2025, with more to come, according to U.S. Commerce Secretary Howard Lutnick.
TSMC, the world’s largest contract chipmaker, hinted at plans to build more manufacturing capacity in the U.S. during its January 15 earnings call, but did not elaborate on any additional investment beyond the $165 billion it has already committed.
Following are details of TSMC’s U.S. investments:
January 2026: TSMC says it has completed the purchase of a second parcel of land in the U.S. state of Arizona to support its expansion plan and give it more flexibility to respond to strong AI-related demand. The plan would enable TSMC to scale up an independent gigafab cluster in Arizona.
March 2025: TSMC says it will expand its U.S. investment to a total of $165 billion, including three additional fabs, two advanced packaging facilities and an R&D centre.
April 2024: The Taiwan contract chipmaker announces plans for a third fab in Arizona, lifting total investment beyond $65 billion.
December 2022: TSMC says it will add a second fab at its Arizona site, raising total planned investment to $40 billion.
May 2020: TSMC announces an initial investment of $12 billion as part of plans to build its first advanced semiconductor fabrication plant in Arizona.
MANUFACTURING IN ARIZONA:
First fab: The facility is up and running, with volume production starting in the fourth quarter of 2024, using 4-nanometre technology.
Second fab: Construction of the second fab completed, with tool move-in and installation planned for 2026. The fab will utilize 3-nanometre process technology, with volume production expected in the second half of 2027.
Third fab: Groundbreaking took place in April 2025, with the facility set to produce 2-nanometre and more advanced process technologies and volume production targeted by the end of the decade.
Fourth, fifth and sixth fabs, two advanced packaging facilities and one R&D centre: TSMC is in the process of applying for permits to begin construction of its fourth fab and first advanced packaging plant. No other timeline has been provided.
CUSTOMERS:
Apple (AAPL.O) , Nvidia (NVDA.O) , AMD (AMD.O) and Qualcomm (QCOM.O) are customers of TSMC’s Arizona fabs. In April 2025, Apple CEO Tim Cook said Apple is TSMC Arizona’s first and largest customer. In October 2025, TSMC Arizona began volume production of Nvidia’s Blackwell GPUs using its advanced N4P process.
