瘋搶芯片市場！日本住友電木計劃將在華半導體封裝產能提高 50%

智通財經
2021.07.27 05:59
日本住友電木 27 日宣佈，將投資 25 億日元在其中國子公司蘇州住友電木建設一條新生產線，提高其 50% 的半導體封裝產能，從目前的 1200 噸提高到 1800 噸。新生產線將於今年年底完成，目標在 2022 年初開始運營，並向中國國內市場發貨。住友電木在全球以及中國半導體封裝市場都佔有 40% 的份額。
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