高通 Hamoa 芯片或在明年量產 採用台積電 4nm 工藝

品玩
2022.06.08 23:39

品玩 6 月 9 日訊，據天風國際分析師郭明錤表示，高通或將推出代號為 Hamoa 的芯片，並預計將會在 2023 年第三季度開始量產。

郭明錤表示，高通的 Hamoa 芯片將會採用 4nm 工藝，用於和蘋果新品進行競爭。此前高通 CEO 安蒙表示，高通將在筆記本電腦和台式電腦領域擊敗 M2 芯片。

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