高通 Hamoa 芯片或在明年量产 采用台积电 4nm 工艺
品玩 6 月 9 日讯，据天风国际分析师郭明錤表示，高通或将推出代号为 Hamoa 的芯片，并预计将会在 2023 年第三季度开始量产。
郭明錤表示，高通的 Hamoa 芯片将会采用 4nm 工艺，用于和苹果新品进行竞争。此前高通 CEO 安蒙表示，高通将在笔记本电脑和台式电脑领域击败 M2 芯片。
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