传台积电先进封装产能利用率松动

USHK News
2022.10.21 07:05
10 月 21 日讯，先进封测供应链业内人士透露：进入第四季度以后，台积电 (TSM.N) 替苹果 iPhone 系列代工的 A 系列应用处理器的整合型晶圆级扇出封装（InFO）的产能利用率已率先松动，预计 2023 年 CoWoS 封装（HPC 芯片用）的产能利用率也有小幅度下滑。
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