傳台積電先進封裝產能利用率鬆動

美港電訊
2022.10.21 07:05
10 月 21 日訊，先進封測供應鏈業內人士透露：進入第四季度以後，台積電 (TSM.N) 替蘋果 iPhone 系列代工的 A 系列應用處理器的整合型晶圓級扇出封裝（InFO）的產能利用率已率先鬆動，預計 2023 年 CoWoS 封裝（HPC 芯片用）的產能利用率也有小幅度下滑。
Source: 美港電訊 The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.