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Zhitong
2022.12.12 00:03

三星：2026 年全球半导体 3nm 制程晶圆代工市场规模将达 242 亿美元 较今年增超 20 倍

三星电子晶圆代工部门高级研究员朴炳宰日前在演讲中表示，到 2026 年，全球半导体 3nm 制程晶圆代工市场规模，较今年的 12 亿美元增长超过 20 倍。
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