Latest NewsYesterday NewsQuote ListTopic ListQuote List
JIN10
2023.03.06 01:59

台媒：苹果自研 5G 基带芯片将采用台积电 3 纳米制程

金十数据 3 月 6 日讯，据界面新闻援引台媒报道，苹果自研 5G 基带芯片研发代号为 Ibiza，将采用台积电 3 纳米制程，配套射频 IC 会采用台积电 7 纳米制程，业界现阶段预期会导入苹果 2024 年推出的 iPhone16 系列手机。由此推算，台积电最快今年下半年就会开始为苹果进行试产，明年上半年逐步拉高投片量。据悉，高通 CEO 安蒙 (Cristiano Amon) 近日出席 2023 年世界移动通信大会 (MWC2023) 时表示，苹果可能在 iPhone16 系列搭载自研 5G 基带芯片。
Source: JIN10 The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.

Like