三星電子在美國發布晶圓代工新技術路線圖

華爾街見聞
2023.06.28 05:23
三星電子當地時間 27 日在美國加州硅谷舉辦 “2023 三星晶圓代工論壇”，發佈瞄準人工智能時代的最尖端晶圓代工流程路線圖，三星電子晶圓代工業務部門社長崔時榮在發表主旨演講時表示，客户公司正在積極開發人工智能專用芯片，三星電子將通過最優化於人工智能芯片的全環繞柵極（Gate All Around，簡稱 GAA）晶體管技術創新，引領人工智能技術模式的變化。（韓聯社）
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