三星电子在美国发布晶圆代工新技术路线图

Wallstreetcn
2023.06.28 05:23
三星电子当地时间 27 日在美国加州硅谷举办 “2023 三星晶圆代工论坛”，发布瞄准人工智能时代的最尖端晶圆代工流程路线图，三星电子晶圆代工业务部门社长崔时荣在发表主旨演讲时表示，客户公司正在积极开发人工智能专用芯片，三星电子将通过最优化于人工智能芯片的全环绕栅极（Gate All Around，简称 GAA）晶体管技术创新，引领人工智能技术模式的变化。（韩联社）
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