台积电拟斥资 29 亿美元在台湾新建芯片封装厂

Zhitong
2023.07.25 08:16
全球最大的半导体制造商台湾积体电路制造股份有限公司计划投资约 900 亿元新台币在台湾新建一家先进的芯片封装和测试晶圆厂。
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