摩根大通：台積電 CoWoS 產能明年底前或翻至每月 2.8 萬至 3 萬片

智通財經
2023.08.16 02:36
摩根大通最新調查顯示，AI 需求下半年持續強勁，台積電 CoWoS 產能擴張進度將超越預期，明年底前產能翻至每月 2.8 萬-3 萬片，尤其 2024 年下半年擴產速度值得期待。摩根大通估計，英偉達 2023 年就佔整體 CoWoS 需求量的 6 成，台積電約可生產 180 萬-190 萬套 H100 芯片，接着需求量較大的則是博通，再來還有亞馬遜雲科技的 Inferentia 芯片與賽靈思。放眼 2024 年，因台積電產能持續擴張，可供應英偉達所需的 H100 芯片數量上看 410 萬～420 萬套。
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