Here is a little nugget from $SMHN which provides a read across to #HBM expansion; particularly at #SKHynix
Suss Microtec makes the temporary bonding tool used by Hynix to stack their HBM memory.This tool has been driving Suss's Advanced Backend Solution Segment.In today's Q1 report Suss disclosed that Q1 orders in this segment were down -15.9% YoY. Moreover, the driver in this years Q1 orders was not the temporary bonder tool, but another tool used in Advanced Packaging.The implication here is that the temp bonder tool orders were down far more than -16% YoY.It is prudent to watch very carefully to see how much incremental capacity Hynix is building for HBM in 2025.Source: Chips & Wafers
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