Powertech, Taiwan’s 2nd biggest semiconductor packaging firm, will more than double 2026 capex to over NT$40 billion (US$1.3 billion), from NT$19 billion this year, media report, adding US$1 billion is for FOPLP (Fan-Out Panel-Level Packaging) advanced packaging, which has already been reserved by clients. Powertech expects some revenue growth from FOPLP next year, and substantially more in 2027. $Applied Materials(AMAT.US) $Teradyne(TER.US) $KLA(KLAC.US) $Micron Tech(MU.US) #Powertech #semiconductors #DRAM #memory
Source: Dan Nystedt
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