TSMC’s overflow of CoWoS advanced packaging orders is turning into a bonanza for ASE Technology, via outsourcing, media report, noting ASE and subsidiary, SPIL, have spent NT$11.2 billion (US$360 M) the past 2-months on plants & equipment to prepare for the influx of TSMC orders. ASE’s advanced packaging revenue is expected to hit US$1.6 billion this year, and increase by over $1 billion more in 2026. $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) $Amkor Tech(AMKR.US) #Semiconductors
Source: Dan Nystedt
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