Rumor: TSMC is facing a massive surge in orders for CoWoS advanced semiconductor packaging, even as CoWoS-L and CoWoS-S remain fully booked, media report, with orders mainly for AI chips from Nvidia, Google, Amazon and MediaTek. TSMC has turned to outsourcing CoWoS production to partners like ASE to help meet client needs. $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) $Advanced Semiconductor Engineering(ASX.US) $Alphabet(GOOGL.US) $Amazon(AMZN.US) $Broadcom(AVGO.US) $AMD(AMD.US)
Source: Dan Nystedt
The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.
