$Intel(INTC.US) According to reports, TSMC's wafer-level packaging technology is in strong demand! Companies including Nvidia, Alphabet (Google's parent), Amazon, Broadcom, and MediaTek are racing to secure production capacity for next-generation AI chips. TSMC's CoWoS production lines are already operating at full capacity. AI giants are driving capacity expansion plans through 2026!
The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.
