Nvidia has booked over half of TSMC’s CoWoS advanced packaging capacity for the next 2-years, even as TSMC aggressively expands, media report, citing equipment suppliers. Nvidia’s orders do not include potential H200 sales to China. 1/5 $NVIDIA(NVDA.US) $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) $Amkor Tech(AMKR.US) $United Microelectronics(UMC.US) $Broadcom(AVGO.US) $AMD(AMD.US) $Tokyo Electron(TOELY.US) $KLA(KLAC.US) $Applied Materials(AMAT.US)
2/5 TSMC’s planned CoWoS capacity has been raised to about 127,000 wafers per month (wpm) by end-2026 on strong demand from GPU and ASIC clients, while rivals, including ASE, Amkor, UMC, have raised to 40,000wpm from 26,000 previously. 3/5 TSMC Arizona’s 2 planned advanced packaging plants are expected to begin mass production in 2028, one after the other, with plant 1 focused on SoIC and CoW, and plant 2 is for CoPoS.4/5 Broadcom is TSMC’s 2nd biggest client for CoWoS, AMD is 3rd and MediaTek is new for 2026. Broadcom is expected to get 240,000 wafers’ capacity in 2026, with 20,000 wafers for MediaTek.5/5 Link: CoWoS: Chip on Wafer on SubstrateSoIC: System on Integrated ChipsCoW: Chip on WaferCoPoS: Chip on Panel on SubstrateSource: Dan Nystedt
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