SEMI: Global semiconductor equipment sales will hit US$145 billion in 2026, after rising 13.7% to a record high $133 B this year, driven by AI-related spending in leading-edge logic and memory chip manufacturing, as well as advanced semiconductor packaging. Growth is seen hitting $156 B in 2027 as the global fab buildout continues.
Fab equipment (front end) seen +11% to $115.7 B this year, beating prior forecast of $110.8 B. Assembly/packaging/test equipment (back end) in 2025: Testing: seen +48.1% to $11.2 BAssembly/packaging: seen +19.6% to $6.4 B$ASML(ASML.US) $Applied Materials(AMAT.US) $Tokyo Electron(TOELY.US) $Lam Research(LRCX.US) $KLA(KLAC.US) $MKS(MKSI.US) $Veeco Instruments(VECO.US) $Axcelis(ACLS.US) $Teradyne(TER.US) $Onto Innovation(ONTO.US) $Camtek(CAMT.US)Source: Dan Nystedt
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