US cloud giants like Google, Meta seeking advanced packaging for their latest AI chips are looking beyond TSMC CoWoS as capacity remains in short supply, media report. Powertech has won exclusive packaging and testing orders from Meta and its production lines are now full, while smaller rival Ardentec, a longtime chip testing partner for TSMC, has also won attention. Powertech’s expertise in memory chip packaging is seen as key to its ability to win big clients. $Taiwan Semiconductor(TSM.US) $Meta Platforms(META.US) $Alphabet(GOOGL.US) #powertech #ardentec
Source: Dan Nystedt
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