📢 𝗝𝗨𝗦𝗧 𝗜𝗡: $Aehr Test(AEHR.US) Aehr Receive

📢 𝗝𝗨𝗦𝗧 𝗜𝗡: $Aehr Test(AEHR.US) Aehr Receives Follow-On Silicon Photonics Production Order

👉 𝗞𝗲𝘆 𝗛𝗶𝗴𝗵𝗹𝗶𝗴𝗵𝘁𝘀:

➤ 𝗔𝗲𝗵𝗿 received a follow-on production order from its lead silicon photonics customer.

➤ Order includes a fully automated 𝗙𝗢𝗫-𝗫𝗣® multi-wafer production burn-in system.

➤ System supports next-generation 𝘀𝗶𝗹𝗶𝗰𝗼𝗻 𝗽𝗵𝗼𝘁𝗼𝗻𝗶𝗰 integrated circuit manufacturing.

➤ Configured with 𝟵 𝗪𝗮𝗳𝗲𝗿𝗣𝗮𝗸® test blades delivering up to 𝟯,𝟱𝟬𝟬 𝘄𝗮𝘁𝘁𝘀 each.

➤ Includes fully automated wafer handling and loading capabilities.

➤ System is expected to ship during the 𝗳𝗶𝗿𝘀𝘁 𝗵𝗮𝗹𝗳 𝗼𝗳 𝟮𝟬𝟮𝟳.

➤ Order supports AI networking, optical transceivers, and chip-to-chip optical I/O.

➤ Aehr sees growing global demand for 𝘄𝗮𝗳𝗲𝗿-𝗹𝗲𝘃𝗲𝗹 𝗯𝘂𝗿𝗻-𝗶𝗻 (𝗪𝗟𝗕𝗜) solutions.

👉 𝗪𝗵𝘆 𝗧𝗵𝗶𝘀 𝗠𝗮𝘁𝘁𝗲𝗿𝘀:

➤ Signals expanding commercial adoption of 𝘀𝗶𝗹𝗶𝗰𝗼𝗻 𝗽𝗵𝗼𝘁𝗼𝗻𝗶𝗰𝘀 for AI infrastructure.

➤ Reinforces demand for advanced semiconductor testing as AI networking scales.

➤ Positions Aehr to benefit from increasing production of AI optical interconnects.

➤ Follow-on production orders may indicate strengthening customer manufacturing demand.

👉 𝗘𝘅𝗽𝗲𝗿𝘁 𝗦𝘁𝗮𝘁𝗲𝗺𝗲𝗻𝘁:

𝗚𝗮𝘆𝗻 𝗘𝗿𝗶𝗰𝗸𝘀𝗼𝗻, President and Chief Executive Officer of Aehr Test Systems:

"This production order is another indication that silicon photonics is moving from technology adoption into manufacturing scale-up, and we believe that transition represents a significant long-term growth opportunity for Aehr. The order reflects our lead silicon photonics customer's continued expansion of manufacturing capacity and represents another important milestone in the industry's transition toward high-volume production of silicon photonic integrated circuits.

"As AI clusters continue to grow in size and performance, silicon photonics is emerging as a key enabling technology for delivering the bandwidth, power efficiency, and scalability required by next-generation AI infrastructure. What began with optical transceivers is now expanding into optical switching, co-packaged optics, linear pluggable optics, and chip-to-chip optical I/O.

"At the same time, the industry is moving toward more highly-integrated optical architectures that integrate or closely co-package laser sources with silicon photonic integrated circuits. These advances improve performance, reduce system cost, simplify manufacturing, and make device reliability even more critical.

"As silicon photonic devices continue to increase in complexity, power density, and production volumes, we believe WLBI is becoming a foundational manufacturing step for many of these next-generation devices. Identifying latent defects and stabilization of the integrated lasers before packaging improves manufacturing yields, lowers overall production costs, and enables the long-term reliability demanded by hyperscale AI infrastructure.

"Over the past year, we've seen a meaningful increase in engagement from silicon photonics companies around the world spanning engineering qualification systems, production capacity planning, and next-generation device roadmaps. These discussions reinforce our belief that the market is approaching an important inflection point.

"As production requirements evolve toward higher power, fully-automated wafer-level manufacturing, and larger production volumes, we believe our FOX-XP platform and integrated automated wafer-level handling solution position Aehr to become the production standard for wafer-level reliability screening of silicon photonic integrated circuits."