Long-term Value InvestorPowerchip Semiconductor held a ceremony for its new 12-inch wafer fab on Thursday (May 3), stating that the first production line has entered the trial production phase and is expected to begin producing silicon interposers for CoWoS packaging in the second half of 2024. Powerchip has invested NT$800 billion so far in this fab, but the total investment will reach NT$300 billion (US$9.2 billion) when fully operational, with a monthly production capacity of 50,000 wafers.$Taiwan Semiconductor(TSM.US)
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