Lingming Photonics denies and countersues RoboSense (02498.HK) for infringement allegations, stating adherence to independent R&D and technological innovation

On December 17, in response to market rumors of litigation, Shenzhen Lingming Photonics Technology Co., Ltd. (referred to as "Lingming Photonics") issued a "Statement of Lawsuit" (hereinafter referred to as the "Statement") on its official website, stating that it has formally filed a lawsuit with the Shenzhen Intermediate People's Court regarding the alleged infringement of its invention patents by the E1 series of $ROBOSENSE(02498.HK), including but not limited to products such as E1R and E1P. Lingming Photonics stated that the company respects and is committed to protecting intellectual property rights, and this action aims to safeguard its innovative achievements and legal rights in accordance with the law.

[Source: Screenshot from the company's official website]

According to reliable sources familiar with Lingming Photonics, more lawsuits may be filed in the future regarding RoboSense's alleged infringement of Lingming's trade secrets and patents. This intellectual property dispute in the LiDAR industry may continue to attract widespread attention. RoboSense (02498.HK) closed at HK$35.90 per share on December 16, down 2.55%, with a total market capitalization of HK$16.952 billion.

On December 7, Lingming Photonics was successfully selected for the 2025 VENTURE50 Hard Tech List. The company focuses on the research and development of 3D sensor chips and photonic devices, with core technologies centered around SPAD (Single Photon Avalanche Diode) device design. Its main products include silicon photomultipliers (SiPM), SPAD imaging sensors (SPADIS), and integrated dToF solutions, which are widely used in smart cars, consumer electronics, and LiDAR applications.

The company's website shows that since its establishment in 2018, Lingming Photonics has been dedicated to independent R&D of SPAD technology, developing solutions covering SiPM, non-3D stacked and 3D stacked dToF SPAD array chips, and LiDAR solutions. In 2021, the company launched China's first 3D stacked SPAD SOC chip, the ADS6303. Each generation of its products has brought LiDAR closer to the performance of cameras, demonstrating the company's deep technical expertise and clear product evolution. The company places high importance on intellectual property protection and has applied for 232+28 patents (232 domestic and 28 foreign), with 52 domestic invention patents, 66 utility model patents, and 13 foreign invention patents already granted. An additional 76 invention patents are under substantive examination, providing a solid foundation for independent R&D.