Taiwan Semiconductor's advanced packaging expansion progresses with the AP8 plant's ceremony today
Taiwan Semiconductor (2330) held a ceremony on the 2nd for the expansion of its AP8 plant, steadily advancing the expansion of advanced packaging. Although this event was more low-key compared to the expansion of the Kaohsiung plant, all suppliers were invited to attend. According to Counterpoint Research, global wafer foundry industry revenue is expected to grow by 26% year-on-year in the fourth quarter of 2024, with Taiwan Semiconductor's market share increasing to 67%. Strong demand for AI is driving advanced packaging, and Taiwan Semiconductor is actively expanding CoWoS-L and CoWoS-R capacity to consolidate its market leadership
Taiwan Semiconductor Manufacturing Company (TSMC) (2330) is steadily advancing its advanced packaging expansion according to plan. The ceremony for TSMC's Advanced Packaging AP8 plant (originally purchased from Innolux 3481) was held on the 2nd. It is understood that this ceremony was much lower profile compared to the recent expansion of the Kaohsiung plant and was not made public, but all supplier partners were invited to attend the event.
According to Counterpoint Research's "Quarterly Tracking Report on Wafer Foundry," the global wafer foundry industry is expected to see a 26% year-on-year revenue increase and a 9% quarter-on-quarter increase in Q4 2024, with TSMC's market share rising to 67%, continuing to lead the industry. The demand for TSMC's advanced packaging is stable and strong, with a focus on expanding CoWoS-L, alleviating market concerns about CoWoS capacity and order adjustments.
According to Counterpoint Research's "Quarterly Tracking Report on Wafer Foundry," the global wafer foundry industry is expected to see a 26% year-on-year revenue increase and a 9% quarter-on-quarter increase in Q4 2024, primarily driven by strong demand for artificial intelligence (AI) and the continued recovery of the Chinese market. The capacity utilization rate of advanced process nodes remains high, driven by demand for AI and flagship smartphones, especially with TSMC's N3 and N5 processes performing exceptionally well.
The agency analyzes that as AI and high-performance computing (HPC) continue to drive demand for advanced processes, advanced packaging technology has become key to industry growth. TSMC is actively expanding CoWoS-L and CoWoS-R capacity, effectively alleviating market concerns about capacity and order adjustments, further consolidating its leading position
