NVIDIA

Taiwan Semiconductor

Direxion Semicon Bull 3X

<p>According to reports, Taiwan Semiconductor is accelerating the expansion of advanced packaging capacity, expecting to reach a monthly capacity of 127,000 CoWoS by the end of 2026, a significant increase of over 20% from the original forecast. NVIDIA accounts for more than half of the capacity, with annual bookings of 800,000 to 850,000 pieces; Broadcom ranks second, securing 240,000 pieces primarily for Meta and Google; AMD ranks third, and MediaTek has also entered the ASIC market</p>

- TSMC is accelerating its advanced packaging capacity to meet the surging demand for AI chips, with plans to reach a monthly capacity of 127,000 units by the end of 2026.  
- The expansion aligns with Morgan Stanley's forecast, which anticipates a significant increase in TSMC's CoWoS capacity to support the growing AI market.  
- This initiative is expected to require an additional capital expenditure of $5 billion to $7 billion, raising TSMC's total capital spending for 2026 to between $48 billion and $50 billion.

Wallstreetcn

Taiwan Semiconductor's CoWoS monthly production is expected to reach 127,000 pieces next year, with NVIDIA accounting for more than half, followed closely by Broadcom and AMD